On May 28, 2026, RESPACK, a first-principles many-body perturbation software package led by Professor Kazuma Nakamura of the Department of Basic Sciences, Faculty of Engineering, received the Grand Prize in the Development Category of the 2026 HPCI Software Award from the HPCI Consortium.
The HPCI Software Award was established by the HPCI Consortium to recognize developers and organizations of Japanese software that has made significant contributions to computational science and is considered particularly beneficial to the research community.
RESPACK is an ab initio software package for deriving low-energy effective models of materials. It provides computational tools for constructing maximally localized Wannier functions, calculating response functions within the random phase approximation, and evaluating frequency-dependent effective interactions. The software is widely used in condensed matter physics and materials science research, particularly in studies of strongly correlated electron systems.
RESPACK has been successfully applied to a wide variety of materials, including metals, semiconductors, transition-metal compounds, and organic materials, and is used by research groups both in Japan and abroad. The award recognizes the long-standing efforts of the RESPACK development team and their contributions to the advancement of computational materials science.
◇HPCI Software Award, click here.
◇RESPACK Official Website, click here.
◇Related publication, click here.
K. Nakamura, Y. Yoshimoto, Y. Nomura, T. Tadano, M. Kawamura, T. Kosugi, K. Yoshimi, T. Misawa, Y. Motoyama, RESPACK: An ab initio tool for derivation of effective low-energy model of material, Comput. Phys. Commun. 261, 107781 (2021).
2026 HPCI Software Award Web Page
RESPACK Official Website
